• DocumentCode
    2551532
  • Title

    Quo vadis, SaaS a system dynamics model based enquiry into the SaaS industry

  • Author

    Das, Chandrima ; Mohan, Guhan ; Roy, Rahul ; Bhattacharya, Subir

  • Author_Institution
    Indian Inst. of Manage. (IIM) Calcutta, Kolkata, India
  • fYear
    2010
  • fDate
    16-18 April 2010
  • Firstpage
    732
  • Lastpage
    737
  • Abstract
    SaaS has quickly become a mainstream business phenomenon by delivering a software product as a service. In this study, we examine the system dynamics of the SaaS business model in light of the drivers of growth, the various types of SaaS applications and the various entities in the SaaS value chain. A modeling approach is followed to determine the effects of various drivers of growth in SaaS business model. In addition, our model tries to determine the relative power of the entities in the SaaS value chain under various scenarios chain and attempts to determine when and how bandwagon effects occur in this industry and isolate the factors that contribute to growth or decline of various types of application revenues. The model is also a means to identify the stakeholders in the value network who gain maximum value under different conditions. Our results suggest that the SaaS industry would fall victim to a stronger substitute business model unless SaaS can move more of its resources to work on applications which are more critical and customized to the needs of a client.
  • Keywords
    business data processing; software engineering; utility programs; SaaS business model; SaaS industry; mainstream business phenomenon; software as a service; software product; system dynamics model based enquiry; Application software; Computer industry; Costs; Hardware; Licenses; Power system modeling; Pricing; Software maintenance; Technological innovation; Web and internet services; SaaS; Substitute technology; System Dynamics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Information Management and Engineering (ICIME), 2010 The 2nd IEEE International Conference on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4244-5263-7
  • Electronic_ISBN
    978-1-4244-5265-1
  • Type

    conf

  • DOI
    10.1109/ICIME.2010.5477966
  • Filename
    5477966