Multi-layer four-way out-of-phase power divider for substrate integrated waveguide applications

In this paper, a novel multi-layer four-way out-of-phase power divider based on substrate integrated waveguide (SIW) is proposed. The four-way power division is realized by 3-D mode coupling; vertical partitioning of a SIW followed by lateral coupling to two half-mode SIW. The measurement results show the excellent insertion loss (S₂₁, S₃₁, S₄₁, S₅₁: -7.0 plusmn 0.5 dB) and input return loss (S₁₁: -10 dB) in X-band (7.63 GHz ~ 11.12 GHz). We expect that the proposed power divider play an important role for the integration of compact multi-way SIW circuits.