Scanning acoustic microscope (SAM)-a measurement tool for plastic IC packages

Author

Nagalingam, Jeanti ; Mohd-Yusoff, S. Dayu ; Ramakrishnan, Puranam ; Jaafar, Rosli ; Francis, Caroline

Author_Institution

Device Anal. Lab., Adv. Micro Devices Export, Penang, Malaysia

fYear

1997

fDate

21-25 Jul 1997

Firstpage

244

Lastpage

249

Abstract

Theoretically, using a 15 MHz transducer, the Scanning Acoustic Microscope (SAM) is shown to have a detection capability of a peak within λ/4 for a depth of 0.06 mm of a typical plastic IC package. A gauge R&R study to determine inspection capability revealed that SAM has a PT ratio of 15.72%. This shows that SAM can be used as a standard measurement tool in plastic IC package dimension measurement. Through a similar methodology used to perform gauge R&R, accurate die paddle tilt measurement was performed with SAM to solve a latent reliability problem for S044 packages with low die paddle tilt/displacement

Keywords

acoustic microscopy; inspection; integrated circuit measurement; integrated circuit packaging; integrated circuit reliability; plastic packaging; spatial variables measurement; 15 MHz; PT ratio; S044 packages; SAM; detection capability; die paddle tilt measurement; dimension measurement; displacement measurement; gauge R&R study; inspection capability; measurement tool; plastic IC package measurement; reliability problem; scanning acoustic microscope; transducer; Acoustic devices; Acoustic measurements; Acoustic signal detection; Acoustic transducers; Measurement standards; Microscopy; Oscilloscopes; Plastic integrated circuit packaging; Time measurement; Vehicle detection;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical & Failure Analysis of Integrated Circuits, 1997., Proceedings of the 1997 6th International Symposium on

Print_ISBN

0-7803-3985-1

Type

conf

DOI

10.1109/IPFA.1997.638324

Filename

638324