DocumentCode :
2552163
Title :
Differences in the laser annealing of a-Si:H and a-SiC films
Author :
García, B. ; Estrada, M. ; Cruz-Gandarilla, F. ; Carreño, M. N P ; Pereyra, I.
Author_Institution :
Depto. Ingenieria Electrica, Instituto Politecnico Nacional, Mexico, Mexico
Volume :
1
fYear :
2004
fDate :
3-5 Nov. 2004
Firstpage :
164
Lastpage :
167
Abstract :
In this paper we compare differences in particle size, surface roughness, resistivity and X-ray diffraction pattern observed in a-Si:C and a-Si0.5C0.5 layers crystallized by excimer (KrF) laser annealing (ELA), under similar conditions. The characteristics of the crystallized films are interpreted considering the difference in melting temperature and thermal coefficient of both materials. Looking toward reducing surface roughness, a comparison of poly-Si layer characteristics, when ELA is done directly and through a SiO2 layer, is also shown.
Keywords :
X-ray diffraction; amorphous semiconductors; crystallisation; electrical resistivity; hydrogen; laser beam annealing; particle size; semiconductor thin films; silicon compounds; surface roughness; wide band gap semiconductors; ELA; Si:H; Si0.5C0.5; SiC; SiO2; X-ray diffraction pattern; a-Si:H films; a-SiC films; electrical resistivity; excimer laser annealing; laser beam annealing; particle size; poly-Si layer characteristics; surface roughness; Annealing; Conductivity; Crystalline materials; Crystallization; Rough surfaces; Surface emitting lasers; Surface roughness; Temperature; X-ray diffraction; X-ray lasers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Devices, Circuits and Systems, 2004. Proceedings of the Fifth IEEE International Caracas Conference on
Print_ISBN :
0-7803-8777-5
Type :
conf
DOI :
10.1109/ICCDCS.2004.1393374
Filename :
1393374
Link To Document :
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