• DocumentCode
    2552222
  • Title

    Effects of the low temperature annealing on the transport mechanisms in n-type a-SiGe:H/p-type c-silicon heterojunctions

  • Author

    Rosales-Quintero, P. ; Torres-Jacome, A. ; Murphy-Arteaga, R. ; Wade, F.J.D. ; Marsal, L.F. ; Cabré, R. ; Pallarés, J.

  • Author_Institution
    Dept. of Electron., Inst. Nacional de Astrofisica, Optica y Electronica, Puebla, Mexico
  • Volume
    1
  • fYear
    2004
  • fDate
    3-5 Nov. 2004
  • Firstpage
    168
  • Lastpage
    171
  • Abstract
    n-type a-SiGe:H on p-type c-silicon heterojunctions were fabricated and electrically characterized. The transport mechanisms were determined by analyzing the temperature dependence of the current-voltage characteristics in two different wafers, with and without thermal annealing at 150°C. At low forward bias (V > 0.5 V), we found that the transport mechanisms are determined by the c-Si in both wafers. The ideality factors were 1.10 and 1.47 for the wafers, with and without low thermal annealing, respectively. At high forward bias (V < 0.5 V), the space charge limited effect became the dominant transport mechanism in all the measured devices. Under reverse bias conditions, the J-V curves showed that the current density is dominated by the carrier generation.
  • Keywords
    Ge-Si alloys; annealing; carrier mobility; current density; elemental semiconductors; p-n heterojunctions; silicon compounds; 150 C; Si; SiGe:H; carrier generation; current density; current-voltage characteristics; low temperature annealing; low thermal annealing; n-type a-SiGe:H; p-n heterojunctions; p-type c-silicon heterojunctions; space charge limited effect; temperature dependence; transport mechanisms; Annealing; Boron; Crystallization; Current density; Gases; Heterojunctions; Hydrogen; Silicon; Temperature; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Devices, Circuits and Systems, 2004. Proceedings of the Fifth IEEE International Caracas Conference on
  • Print_ISBN
    0-7803-8777-5
  • Type

    conf

  • DOI
    10.1109/ICCDCS.2004.1393375
  • Filename
    1393375