• DocumentCode
    2552324
  • Title

    New vertical silicon microwave power transistor structure and package with inherent thermal self protection

  • Author

    Gogoi, Bishnu ; Davies, Robert ; Crowder, Jeff ; Lutz, David ; Le, Phuong ; Rice, David ; Wright, Walt ; Battaglia, Brian ; Tran, Son ; Elliott, A. Lex ; Golio, Mike

  • Author_Institution
    HVVi Semicond. Inc., Phoenix, AZ, USA
  • fYear
    2009
  • fDate
    7-12 June 2009
  • Firstpage
    569
  • Lastpage
    572
  • Abstract
    A novel vertical silicon high voltage microwave power transistor is reported with high degree of robustness and inherent thermal self protection. The HVVFET device uses a deep dielectric platform with uniform channel doping that approaches near ideal breakdown voltages (> 110 Volts) for suitable epitaxial thickness and doping levels resulting in high power density. An integrated shield enables significant reduction in the feedback capacitance resulting in devices with fT > 6 GHz and gain in excess of 15 dB, with VSWR of 20:1. Flip-chip gold bumps are used to achieve short thermal transfer path to the flange and achieve inherent thermal self protection.
  • Keywords
    flip-chip devices; microwave power transistors; power field effect transistors; thermal stability; channel doping; flip-chip gold bumps; microwave power transistor; thermal self protection; thermal transfer path; Dielectric devices; Doping; Feedback; Microwave devices; Packaging; Power transistors; Protection; Robustness; Silicon; Voltage; Flip-chip RF power transistor; High Voltage power transistor; Ruggedness; Silicon Power Transistor; Vertical RF transistor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 2009. MTT '09. IEEE MTT-S International
  • Conference_Location
    Boston, MA
  • ISSN
    0149-645X
  • Print_ISBN
    978-1-4244-2803-8
  • Electronic_ISBN
    0149-645X
  • Type

    conf

  • DOI
    10.1109/MWSYM.2009.5165760
  • Filename
    5165760