DocumentCode
2552324
Title
New vertical silicon microwave power transistor structure and package with inherent thermal self protection
Author
Gogoi, Bishnu ; Davies, Robert ; Crowder, Jeff ; Lutz, David ; Le, Phuong ; Rice, David ; Wright, Walt ; Battaglia, Brian ; Tran, Son ; Elliott, A. Lex ; Golio, Mike
Author_Institution
HVVi Semicond. Inc., Phoenix, AZ, USA
fYear
2009
fDate
7-12 June 2009
Firstpage
569
Lastpage
572
Abstract
A novel vertical silicon high voltage microwave power transistor is reported with high degree of robustness and inherent thermal self protection. The HVVFET device uses a deep dielectric platform with uniform channel doping that approaches near ideal breakdown voltages (> 110 Volts) for suitable epitaxial thickness and doping levels resulting in high power density. An integrated shield enables significant reduction in the feedback capacitance resulting in devices with fT > 6 GHz and gain in excess of 15 dB, with VSWR of 20:1. Flip-chip gold bumps are used to achieve short thermal transfer path to the flange and achieve inherent thermal self protection.
Keywords
flip-chip devices; microwave power transistors; power field effect transistors; thermal stability; channel doping; flip-chip gold bumps; microwave power transistor; thermal self protection; thermal transfer path; Dielectric devices; Doping; Feedback; Microwave devices; Packaging; Power transistors; Protection; Robustness; Silicon; Voltage; Flip-chip RF power transistor; High Voltage power transistor; Ruggedness; Silicon Power Transistor; Vertical RF transistor;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 2009. MTT '09. IEEE MTT-S International
Conference_Location
Boston, MA
ISSN
0149-645X
Print_ISBN
978-1-4244-2803-8
Electronic_ISBN
0149-645X
Type
conf
DOI
10.1109/MWSYM.2009.5165760
Filename
5165760
Link To Document