Copper/titanium dioxide thick film and application for through-hole

Author

Taniguchi, Yoshiaki ; Yoshihara, Toshio ; Tsukada, Takeshi

Author_Institution

Copal Res. & Dev. Lab. Co. Ltd., Tokyo, Japan

fYear

1988

fDate

9-11 May 1988

Firstpage

589

Lastpage

595

Abstract

The mechanism of strip-off and the characteristics of conductor materials are investigated. Roughness and other features that affect the adhesion are investigated by SEM and EPMA in order to elucidate why the conventional copper thick film will not form a reliable conductor on a laser-drilled through-hole. A copper paste to which a large amount of titanium dioxide powder is added is studied. Titanium dioxide reduces the shrinkage of the conductor in firing and makes the thermal expansion coefficient close to that of the substrate. Adhesion to the substrate, resistance, and conductor condition on the hole are evaluated. The microstructure and crystalline phase of the copper/titanium-dioxide fired thick film are analyzed to clarify the adhesion mechanism. It is found that compound forms between the titanium dioxide and the alumina, which increases the adhesion.<>

Keywords

adhesion; copper; electron probe analysis; hybrid integrated circuits; integrated circuit technology; scanning electron microscope examination of materials; surface topography; thick films; titanium compounds; Al/sub 2/O/sub 3/; Cu-TiO/sub 2/ thick films; EPMA; SEM; adhesion; alumina; crystalline phase; electron probe microanalyser; fired thick film; hybrid integrated circuit; laser-drilled through-hole; microstructure; roughness; sheet resistance; strip-off mechanism; thermal expansion coefficient; Adhesives; Conducting materials; Conductive films; Conductors; Copper; Optical materials; Powders; Substrates; Thick films; Titanium;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Components Conference, 1988., Proceedings of the 38th

Conference_Location

Los Angeles, CA, USA

Type

conf

DOI

10.1109/ECC.1988.12653

Filename

12653