Substrate-embedded millimeter wave SiGe VCO chip

Author

Richter, Marius D. ; Schneider, Martin

Author_Institution

RF & Microwave Eng. Lab., Univ. of Bremen, Bremen, Germany

fYear

2009

fDate

7-12 June 2009

Firstpage

605

Lastpage

608

Abstract

A 77 GHz SiGe voltage controlled oscillator (VCO) chip is completely buried inside a printed circuit board (PCB) and connected to a high frequency laminate on top of the PCB using microvias. Several modules each containing a buried VCO chip are fabricated. The performance of these buried VCO chips regarding tuning range and output power is comparable with the measured performance of a classically connected VCO chip using wire bond technology. The successful operation of active monolithic microwave integrated circuits (MMICs) buried inside PCBs shows the potential of the novel technology used here.

Keywords

Ge-Si alloys; MMIC; integrated circuit packaging; printed circuit design; voltage-controlled oscillators; MMIC; SiGe; SiGe VCO chip; frequency 77 GHz; monolithic microwave integrated circuit; printed circuit board; substrate-embedded millimeter wave; voltage controlled oscillator; Frequency; Germanium silicon alloys; Integrated circuit technology; Laminates; MMICs; Millimeter wave circuits; Millimeter wave technology; Printed circuits; Silicon germanium; Voltage-controlled oscillators; MMIC oscillators; integrated circuit packaging; printed circuit layout; tunable oscillators;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 2009. MTT '09. IEEE MTT-S International

Conference_Location

Boston, MA

ISSN

0149-645X

Print_ISBN

978-1-4244-2803-8

Electronic_ISBN

0149-645X

Type

conf

DOI

10.1109/MWSYM.2009.5165769

Filename

5165769