• DocumentCode
    2552554
  • Title

    Ultra-low-profile small-size LTCC front-end module (FEM) for WLAN applications based on a novel diplexer design approach

  • Author

    Sakhnenko, Sergiy ; Orlenko, Denys ; Vorotniko, Borys ; Aleksieiev, Oleg ; Komakha, Petro ; Heide, Patric ; Vossiek, Martin

  • Author_Institution
    Product Dev. Modules, EPCOS AG, Munich, Germany
  • fYear
    2009
  • fDate
    7-12 June 2009
  • Firstpage
    609
  • Lastpage
    612
  • Abstract
    This paper reports on the design of a very compact dual-band highly-integrated front-end module for size-critical wireless applications supporting IEEE 802.11a/b/g standards. The module consists of two novel high-rejection lumped-element diplexers which are connected to one common antenna via single-pole-double-through (SPDT) switch. The novelty of the realized diplexers consists in a new conjugate-matching method which allows to design very compact diplexers without additional matching networks. The LTCC integrated diplexers are placed between two ground planes ensuring high electromagnetic compatibility which allows using them as building blocks of the highly-integrated wireless LAN (WLAN) front-end module. The physical dimensions of the complete module are 3.0 times 3.0 times 0.95 mm. Up to date this is a smallest LTCC-based switch-diplexer FEM published so far.
  • Keywords
    ceramic packaging; multiplexing equipment; wireless LAN; IEEE 802.11a standard; IEEE 802.11b standard; IEEE 802.11g standard; LTCC front-end module; WLAN; antenna; conjugate-matching method; diplexer design approach; high-rejection lumped-element diplexers; single-pole-double-through switch; Band pass filters; Ceramics; Communication switching; Dual band; Information technology; Product development; Radio frequency; Surface-mount technology; Switches; Wireless LAN; Diplexers; Filters; LTCC; WLAN; front-end module;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 2009. MTT '09. IEEE MTT-S International
  • Conference_Location
    Boston, MA
  • ISSN
    0149-645X
  • Print_ISBN
    978-1-4244-2803-8
  • Electronic_ISBN
    0149-645X
  • Type

    conf

  • DOI
    10.1109/MWSYM.2009.5165770
  • Filename
    5165770