DocumentCode
2553052
Title
Miniaturized hybrid ring circuits using T-type folded substrate integrated waveguide (TFSIW)
Author
Ding, Yan ; Wu, Ke
Author_Institution
Dept. of Elec. Eng., Ecole Polytech. (Univ. of Montreal), Montreal, QC, Canada
fYear
2009
fDate
7-12 June 2009
Firstpage
705
Lastpage
708
Abstract
T-type folded substrate integrated waveguide (TFSIW) scheme is an effective SIW miniaturization technique for developing high-density integrated circuits. In this paper, the propagation constant and characteristic impedance of TFSIW structures are analyzed on the basis of their equivalent circuits. To demonstrate the circuit applications, the design procedure of a proposed TFSIW hybrid ring is presented and discussed with reference to the calculated parameters. Simulation results of the designed coupler ring circuit are compared with measurement results.
Keywords
coupled circuits; electric impedance; equivalent circuits; substrate integrated waveguides; SIW miniaturization; T-type folded substrate integrated waveguide; TFSIW structure; characteristic impedance; circuit design; coupler ring circuit; equivalent circuit; high-density integrated circuit; miniaturized hybrid ring circuit; propagation constant; Circuit simulation; Coupling circuits; Equivalent circuits; Impedance; Integrated circuit measurements; Microwave theory and techniques; Propagation constant; Radio frequency; Research and development; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 2009. MTT '09. IEEE MTT-S International
Conference_Location
Boston, MA
ISSN
0149-645X
Print_ISBN
978-1-4244-2803-8
Electronic_ISBN
0149-645X
Type
conf
DOI
10.1109/MWSYM.2009.5165794
Filename
5165794
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