• DocumentCode
    2553052
  • Title

    Miniaturized hybrid ring circuits using T-type folded substrate integrated waveguide (TFSIW)

  • Author

    Ding, Yan ; Wu, Ke

  • Author_Institution
    Dept. of Elec. Eng., Ecole Polytech. (Univ. of Montreal), Montreal, QC, Canada
  • fYear
    2009
  • fDate
    7-12 June 2009
  • Firstpage
    705
  • Lastpage
    708
  • Abstract
    T-type folded substrate integrated waveguide (TFSIW) scheme is an effective SIW miniaturization technique for developing high-density integrated circuits. In this paper, the propagation constant and characteristic impedance of TFSIW structures are analyzed on the basis of their equivalent circuits. To demonstrate the circuit applications, the design procedure of a proposed TFSIW hybrid ring is presented and discussed with reference to the calculated parameters. Simulation results of the designed coupler ring circuit are compared with measurement results.
  • Keywords
    coupled circuits; electric impedance; equivalent circuits; substrate integrated waveguides; SIW miniaturization; T-type folded substrate integrated waveguide; TFSIW structure; characteristic impedance; circuit design; coupler ring circuit; equivalent circuit; high-density integrated circuit; miniaturized hybrid ring circuit; propagation constant; Circuit simulation; Coupling circuits; Equivalent circuits; Impedance; Integrated circuit measurements; Microwave theory and techniques; Propagation constant; Radio frequency; Research and development; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 2009. MTT '09. IEEE MTT-S International
  • Conference_Location
    Boston, MA
  • ISSN
    0149-645X
  • Print_ISBN
    978-1-4244-2803-8
  • Electronic_ISBN
    0149-645X
  • Type

    conf

  • DOI
    10.1109/MWSYM.2009.5165794
  • Filename
    5165794