DocumentCode :
2553204
Title :
Design considerations of Sub-100nm Dual Material Gate Fully Depleted Silicon On Insulator (DMG-FD-SOI)
Author :
Jafar, Norsyahida ; Soin, Norhayati
Author_Institution :
Dept. of Electr., Univ. of Malaya, Kuala Lumpur
fYear :
2008
fDate :
25-27 Nov. 2008
Firstpage :
69
Lastpage :
75
Abstract :
This paper presents the results of extensive simulations on the characterization of asymmetrical channel device, namely Dual material Gate Fully Depleted Silicon On Insulator (DMG-FD-SOI) in the sub-100nm dimensions with emphasis on the analog, radio frequency (RF) performances and short channel effects (SCEs). The obtained results may serve as useful guidelines to get a basis overview of this gate-material engineered architecture. Improvement on cut-off, int T and maximum oscillation frequency, int max are observed with the applied DMG design. Better SCEs and analog performances which are open loop gain (gm/gd) and ION/IOFF ratio can be achieved with reduced silicon thickness, Tsi but with drawback on degraded int T and int max. For shorter gate length design of DMG in sub-100 nm dimension, higher threshold voltage, VTH can be applied for SCEs suppression with insignificant degradation on the analog and RF point of views.
Keywords :
semiconductor device models; semiconductor device reliability; silicon-on-insulator; DMG-FD-SOI device design; Si; analog device; asymmetrical channel device simulations; cut-off frequency; dual material gate fully depleted silicon on insulator device; gate length; maximum oscillation frequency; open loop gain; radio frequency device; reliability; short channel effects; threshold voltage; Analytical models; Cutoff frequency; Degradation; Design engineering; Guidelines; Performance gain; Radio frequency; Scattering parameters; Silicon on insulator technology; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Electronics, 2008. ICSE 2008. IEEE International Conference on
Conference_Location :
Johor Bahru
Print_ISBN :
978-1-4244-3873-0
Electronic_ISBN :
978-1-4244-2561-7
Type :
conf
DOI :
10.1109/SMELEC.2008.4770279
Filename :
4770279
Link To Document :
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