DocumentCode
2553204
Title
Design considerations of Sub-100nm Dual Material Gate Fully Depleted Silicon On Insulator (DMG-FD-SOI)
Author
Jafar, Norsyahida ; Soin, Norhayati
Author_Institution
Dept. of Electr., Univ. of Malaya, Kuala Lumpur
fYear
2008
fDate
25-27 Nov. 2008
Firstpage
69
Lastpage
75
Abstract
This paper presents the results of extensive simulations on the characterization of asymmetrical channel device, namely Dual material Gate Fully Depleted Silicon On Insulator (DMG-FD-SOI) in the sub-100nm dimensions with emphasis on the analog, radio frequency (RF) performances and short channel effects (SCEs). The obtained results may serve as useful guidelines to get a basis overview of this gate-material engineered architecture. Improvement on cut-off, int T and maximum oscillation frequency, int max are observed with the applied DMG design. Better SCEs and analog performances which are open loop gain (gm/gd) and ION/IOFF ratio can be achieved with reduced silicon thickness, Tsi but with drawback on degraded int T and int max. For shorter gate length design of DMG in sub-100 nm dimension, higher threshold voltage, VTH can be applied for SCEs suppression with insignificant degradation on the analog and RF point of views.
Keywords
semiconductor device models; semiconductor device reliability; silicon-on-insulator; DMG-FD-SOI device design; Si; analog device; asymmetrical channel device simulations; cut-off frequency; dual material gate fully depleted silicon on insulator device; gate length; maximum oscillation frequency; open loop gain; radio frequency device; reliability; short channel effects; threshold voltage; Analytical models; Cutoff frequency; Degradation; Design engineering; Guidelines; Performance gain; Radio frequency; Scattering parameters; Silicon on insulator technology; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Electronics, 2008. ICSE 2008. IEEE International Conference on
Conference_Location
Johor Bahru
Print_ISBN
978-1-4244-3873-0
Electronic_ISBN
978-1-4244-2561-7
Type
conf
DOI
10.1109/SMELEC.2008.4770279
Filename
4770279
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