• DocumentCode
    2553270
  • Title

    Faster delay modeling and power optimization for on-chip global interconnects

  • Author

    Aswatha, A.R. ; Basavaraju, T.

  • Author_Institution
    Dayanand Sagar Coll. of Eng., Dr.M.G.R.Univ., Bangalore
  • fYear
    2008
  • fDate
    25-27 Nov. 2008
  • Firstpage
    82
  • Lastpage
    86
  • Abstract
    The total number of nets in a modern IC design has increased dramatically and exceeded millions. Therefore efficient delay modeling of interconnection is needed for high speed ICpsilas. This paper presents a closed-form expressions for RLC interconnection trees in current mode signaling, which can be implemented in VLSI design tool. These analytical model expressions can be used for accurate calculation of delay after the design clock tree has been laid out and the design is fully routed. Evaluation of this analytical model is several orders of magnitude faster than simulation using SPICE. The power consumption of interconnects has become an important issue as technology scales down. For voltage mode signaling optimum line width that minimizes the total transient power dissipation is discussed in this paper. Closed form solutions are presented for inserting repeaters into RLC lines that are highly accurate with respect to numerical solutions. Considering inductance in repeater insertion significantly saves the repeater area and power consumption.
  • Keywords
    VLSI; circuit optimisation; delays; integrated circuit design; integrated circuit interconnections; trees (mathematics); RLC lines; VLSI design tool; analytical model expression; clock tree design; closed-form expression; faster delay modeling; inductance; interconnects power consumption; modern IC design; on-chip global interconnects; power optimization; repeater insertion; total transient power dissipation; voltage mode signaling optimum line width; Analytical models; Clocks; Closed-form solution; Delay; Energy consumption; Repeaters; SPICE; Signal design; Very large scale integration; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Electronics, 2008. ICSE 2008. IEEE International Conference on
  • Conference_Location
    Johor Bahru
  • Print_ISBN
    978-1-4244-3873-0
  • Electronic_ISBN
    978-1-4244-2561-7
  • Type

    conf

  • DOI
    10.1109/SMELEC.2008.4770281
  • Filename
    4770281