Title :
Parametric simulations of a micromachined mesoscopic acoustic speaker
Author :
Ayatollahi, Fatima Lina ; Majlis, Burhanuddin Yeop
Author_Institution :
Inst. of Microeng. & Nanoelectron., Univ. Kebangsaan Malaysia, Bangi
Abstract :
This paper presents parametric simulations of a micromachined mesoscopic acoustic speaker for hearing aid applications. The microspeaker has a single turn copper coil on a polyimide membrane, and a NdFeB permanent magnet beneath the membrane. The fields due to the permanent magnet were computed using FEMM. Then, forces based on the fields and on the coil driving current were computed. Finally, IntelliSuite was employed to simulate membrane displacements and stresses. The device, with a polyimide membrane diameter of 2.5 mm and thickness of 2 mum, consumes 0.1 mW to generate a sound pressure level of 120 dB in the human ear.
Keywords :
acoustic devices; boron alloys; copper; finite element analysis; hearing aids; iron alloys; mesoscopic systems; micromachining; micromechanical devices; neodymium alloys; permanent magnets; FEMM; IntelliSuite; NdFeB; coil driving current; finite element method magnetics; hearing aid; membrane displacement; membrane stresses; micromachined mesoscopic acoustic speaker; microspeaker; parametric simulation; permanent magnet; polyimide membrane; power 0.1 mW; single turn copper coil; size 2 mum; size 2.5 mm; Acoustic applications; Auditory system; Biomembranes; Coils; Computational modeling; Copper; Loudspeakers; Permanent magnets; Polyimides; Stress;
Conference_Titel :
Semiconductor Electronics, 2008. ICSE 2008. IEEE International Conference on
Conference_Location :
Johor Bahru
Print_ISBN :
978-1-4244-3873-0
Electronic_ISBN :
978-1-4244-2561-7
DOI :
10.1109/SMELEC.2008.4770306
