DocumentCode
2554209
Title
Quantitative comparison between domestic and offshoring projects in the software factory environment driven by UML-modelled development standard
Author
Matsuyama, Keiichi
Author_Institution
EXA Corp., Kawasaki, Japan
fYear
2010
fDate
16-18 April 2010
Firstpage
590
Lastpage
596
Abstract
If we can depict our development standard by UML model and load it on a software factory engine which controls projects as we modelled, we´ll be able to control over projects more effectively and make them more predictable. We named this concept as Model-Driven Adaptive Development (MDAD) and have been conducting researches. On the other hand Japanese SI´ers already have an insight that off shoring is to be one of the essential factors to maintain or gain their competitiveness. But it´s not easy to make a valid comparison between off shoring project and domestic project concerning to their productivity and quality. This paper examines two research projects executed in MDAD environment with the same development standard model loaded. One project was executed by only domestic resources in 2008 and the other one by cooperation with offshore resources in 2009. Both projects developed exactly the same in-house system. This analysis based on various measured data of both projects provides quantitative insights into productivity and quality of the off shoring project by comparison with the domestic project, and also exposes some of the prerequisites for executing off shore projects successfully.
Keywords
Unified Modeling Language; software engineering; MDAD; UML modelled development standard; domestic projects; model driven adaptive development; offshoring projects; quantitative comparison; software factory environment; Access protocols; Authentication; Network servers; Production facilities; Software standards; Standards development; WiMAX; Wireless LAN; Wireless application protocol; Wireless networks;
fLanguage
English
Publisher
ieee
Conference_Titel
Information Management and Engineering (ICIME), 2010 The 2nd IEEE International Conference on
Conference_Location
Chengdu
Print_ISBN
978-1-4244-5263-7
Electronic_ISBN
978-1-4244-5265-1
Type
conf
DOI
10.1109/ICIME.2010.5478090
Filename
5478090
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