DocumentCode
2554424
Title
The preparation of Copper phthalocyanine thin film on silicon substrate for solar cell application
Author
Hassan, Haitham ; Ibrahim, N.B. ; Ibarahim, Z. ; Sopian, K.
Author_Institution
Sch. of Appl. Phys., Univ. Kebangsaan Malaysia, Bangi
fYear
2008
fDate
25-27 Nov. 2008
Firstpage
326
Lastpage
330
Abstract
Nowadays, the organic base solar cell has attracted a lot of interests due to its potential as a low cost solar cell. This paper investigates the potential of the organic material which is copper phthalocyanine (CuPc) as the p-type organic material in the solar cell. The CuPc films have been prepared by spin coating technique on Si-n substrate. The optical properties of CuPc thin film were studied using the UV-Vis-NIR spectrometer in the spectral range 300-800 nm. The CuPc was grown on the glass substrate to study the optical properties. The band gap of the films has been calculated directly from the data plotted. The best properties of CuPc thin film was used to develop an organic / inorganic : Al / Si-n / CuPc / Ag solar cell. The electrical property which is I-V characterization shows the performance and the efficiency of the cell due to the film thicknesses.
Keywords
energy gap; infrared spectra; organic compounds; solar cells; spin coating; ultraviolet spectra; visible spectra; I-V characterization; Si; UV-Vis-NIR spectrometer; band gap; copper phthalocyanine thin film preparation; electrical property; film thickness; optical properties; organic base solar cell; p-type organic material; silicon substrate; spin coating technique; wavelength 300 nm to 800 nm; Coatings; Copper; Costs; Optical films; Organic materials; Photovoltaic cells; Semiconductor thin films; Silicon; Spectroscopy; Substrates; IV Measurement; Optical Band Gap; Organic CuPc; Solar cell; n-type Si;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Electronics, 2008. ICSE 2008. IEEE International Conference on
Conference_Location
Johor Bahru
Print_ISBN
978-1-4244-3873-0
Electronic_ISBN
978-1-4244-2561-7
Type
conf
DOI
10.1109/SMELEC.2008.4770334
Filename
4770334
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