DocumentCode
2554457
Title
Development of gas sensor system based on the TiO2 /Pani composite thin film
Author
Izzuddin, Izura ; Ramli, Norhashimah ; Salleh, Muhamad Mat ; Yahaya, Muhammad ; Jumali, Mohammad Hafizuddin
Author_Institution
Sch. of Appl. Phys., Univ. Kebangsaan Malaysia, Bangi
fYear
2008
fDate
25-27 Nov. 2008
Firstpage
336
Lastpage
339
Abstract
Development of organic and inorganic composites has grown in recent years due to a wide range of potential use of these materials. The aim of this research is to investigate the effect of Pani additions on the TiO2 based thin film as VOC gas sensing properties. TiO2 were prepared using sol gel technique. Up to 3 wt% of Pani were directly added to the TiO2 solution. 3 layers of TiO2/Pani solution mixture were deposited onto SiO2 coated silicon substrate using spin coating technique for fabrications of gas sensing device. The microstructures properties of samples were investigated using XRD, TEM and SEM. In addition, all samples were exposed to ethanol for gas sensing performance test. The gas sensing test revealed that all films were responsive towards ethanol vapour exposure with 2 wt% TiO2/Pani film exhibited the best sensitivity. However, over longer exposure cycles, it was observed that 3 wt% TiO2/Pani film have a better stability.
Keywords
X-ray diffraction; gas sensors; organic compounds; scanning electron microscopy; sol-gel processing; spin coating; titanium compounds; transmission electron microscopy; SEM; TEM; TiO2; VOC gas sensing; XRD; ethanol vapour exposure; gas sensor system; inorganic composites; microstructure property; organic composites; sol gel technique; spin coating technique; titanium dioxide-Pani composite thin film; Coatings; Composite materials; Ethanol; Gas detectors; Inorganic materials; Organic materials; Silicon; Substrates; Testing; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Electronics, 2008. ICSE 2008. IEEE International Conference on
Conference_Location
Johor Bahru
Print_ISBN
978-1-4244-3873-0
Electronic_ISBN
978-1-4244-2561-7
Type
conf
DOI
10.1109/SMELEC.2008.4770336
Filename
4770336
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