• DocumentCode
    2554721
  • Title

    TPX heating and cooling system

  • Author

    Kungl, D.J. ; Knutson, D.S. ; Costello, J. ; Stoenescu, S. ; Yemin, L.

  • Author_Institution
    Plasma Phys. Lab., Princeton Univ., NJ, USA
  • Volume
    2
  • fYear
    1995
  • fDate
    30 Sep-5 Oct 1995
  • Firstpage
    1323
  • Abstract
    TPX, while having primarily super-conducting coils that do not require water cooling, still has very significant water cooling requirements for the plasma heating systems, vacuum vessel, plasma facing components, diagnostics, and ancillary equipment. This is accentuated by the 1000-second pulse requirement. Two major design changes, which have significantly affected the TPX heating and cooling system, have been made since the conceptual design review in March of 1993. These are (1) changing the vacuum vessel neutron shielding configuration, and (2) reducing the vacuum vessel operating temperature. This paper will discuss these changes and review the current status of the conceptual design. In all, six different heating and cooling supply requirements (temperature, pressure, water quality) for the various TPX components must be met. This paper will detail these requirements and provide an overview of the heating and cooling system design while focusing on the ramifications of the TPX changes
  • Keywords
    Tokamak devices; cooling; fusion reactor design; fusion reactors; shielding; vacuum apparatus; 1000 s; 50 C; TPX; ancillary equipment; conceptual design; cooling supply requirements; design changes; diagnostics; plasma facing components; plasma heating systems; vacuum vessel; vacuum vessel neutron shielding configuration; vacuum vessel operating temperature; water cooling requirements; Coils; Glass; Physics; Plasma diagnostics; Plasma temperature; Space cooling; Space heating; Tiles; Vacuum systems; Water heating;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Fusion Engineering, 1995. SOFE '95. Seeking a New Energy Era., 16th IEEE/NPSS Symposium
  • Conference_Location
    Champaign, IL
  • Print_ISBN
    0-7803-2969-4
  • Type

    conf

  • DOI
    10.1109/FUSION.1995.534471
  • Filename
    534471