Thermal management issues in Laser diode packaging

Author

Verma, Alok Jyoti ; Makkar, R. ; Chalapathi, K.

Author_Institution

Soc. for Appl. Microwave Electron. Eng.&Res. (SAMEER), Mumbai

fYear

2008

fDate

25-27 Nov. 2008

Firstpage

398

Lastpage

401

Abstract

SAMEER has recently setup an infrastructure to dasiapigtail and package laser diodespsila using optical epoxy and laser weld techniques. Few laser diodes have been packaged using dasiafiber alignment and laser weld system (FALWS)psila in butterfly and TO-CAN packages. The high power laser diode packaging involves good thermal management and post-weld shift challenges, and it is being experimentally verified with theoretical simulation. The laser diode packaging followed by reliability test as per Telcordia standard is the current technical challenges ahead.

Keywords

semiconductor lasers; thermal management (packaging); TO-CAN packages; fiber alignment and laser weld system; laser diode packaging; optical epoxy; pigtail laser diodes; thermal management; Diode lasers; Electronic packaging thermal management; Erbium-doped fiber lasers; Laser excitation; Laser theory; Optical pumping; Power lasers; Pump lasers; Temperature; Thermal management; Fiber -alignment; High Power Laser Diode; Laser weld;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Electronics, 2008. ICSE 2008. IEEE International Conference on

Conference_Location

Johor Bahru

Print_ISBN

978-1-4244-3873-0

Electronic_ISBN

978-1-4244-2561-7

Type

conf

DOI

10.1109/SMELEC.2008.4770349

Filename

4770349