DocumentCode
2554981
Title
A case study of NMOS AC hot carrier injection lifetime improvement
Author
Dong, Zhang ; Tien, David Kho Ching ; Sool, Koo Sang ; Choong, Kim Eui
Author_Institution
X-FAB Sarawak Sdn. Bhd., Kuching
fYear
2008
fDate
25-27 Nov. 2008
Firstpage
455
Lastpage
457
Abstract
The work presented here shows a series of engineering runs to improve the AC HCI lifetime for a 0.60 mum NMOS. The conventional method of increasing NLDD energy and reducing NLDD dose did not achieve significant improvement. The study concludes that tilting the NLDD implant, coupled with prolonging the NLDD anneal and increasing the Poly CD can improve the lifetime significantly. A short HCI test was performed to compare the response of different splits. Process simulation was also being performed to visualise variances in electrical field distribution associated with the differing splits.
Keywords
MOS analogue integrated circuits; hot carriers; HCI test; NLDD energy; NLDD implant; NMOS AC hot carrier injection lifetime improvement; Poly CD; electrical field distribution; size 0.60 mum; Annealing; Degradation; Hot carrier injection; Hot carriers; Human computer interaction; Impact ionization; Implants; MOS devices; Silicon; Substrate hot electron injection;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Electronics, 2008. ICSE 2008. IEEE International Conference on
Conference_Location
Johor Bahru
Print_ISBN
978-1-4244-3873-0
Electronic_ISBN
978-1-4244-2561-7
Type
conf
DOI
10.1109/SMELEC.2008.4770362
Filename
4770362
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