Title :
Equivalent circuit models of via interactions in electronics packaging
Author :
Chen, Yuzhe ; Wu, Zhonghua ; Liu, Yaowu ; Fang, Jiayuan
Author_Institution :
Dept. of Electr. Eng., State Univ. of New York, Binghamton, NY, USA
Abstract :
This paper presents the SPICE-type of equivalent circuit models for via interactions between conducting planes. These equivalent circuit models are derived from the radial transmission line theory. Transient simulation results from SPICE with our models are in excellent agreement with those from the inverse Fourier transformation of frequency domain solutions. These models can be used in various applications, such as the simulation of Delta-I noise in electronics packaging
Keywords :
SPICE; circuit analysis computing; equivalent circuits; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; transmission line theory; Delta-I noise; IC technology; SPICE; chip packages; conducting planes; electronics packaging; equivalent circuit models; frequency domain solutions; interactions; inverse Fourier transformation; radial transmission line theory; transient simulation results; Circuit simulation; Crosstalk; Electronics packaging; Equivalent circuits; Impedance; Integrated circuit noise; Integrated circuit packaging; SPICE; Transmission line theory; Voltage;
Conference_Titel :
Electromagnetic Compatibility, 1994. Symposium Record. Compatibility in the Loop., IEEE International Symposium on
Conference_Location :
Chicago, IL
Print_ISBN :
0-7803-1398-4
DOI :
10.1109/ISEMC.1994.385628
