• DocumentCode
    2555717
  • Title

    The Signal Integrity of the High-Speed IC Design

  • Author

    Huang, Kaer ; Liu, Wenyi ; Zhang, Yan ; Yan, Hongcheng

  • Author_Institution
    Nat. Key Lab. for Electron. Meas. Technol., North Univ. of China, Taiyuan, China
  • fYear
    2010
  • fDate
    23-25 Sept. 2010
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    With the continuous improvement of the Embedded Microprocessor´s main frequency, the signal transmission and processing becoming faster and faster, the traditional method of circuit design and software will not be able to meet the requirements of high-speed circuit design. However, an increasing number of VLSI chips´ work frequency has reached above 100MHZ, the CPU with 450MHz will also be widely used. The edge of the signal is becoming steeper and steeper (has reached ps), which makes high-speed system design must face a variety of signal integrity issues. This paper presents a number of common signal integrity issues, and the corresponding improvement of the program. In addition, in the premise of that consider signal integrity in the process of high-speed circuit design, given the specific design, given out the solution for important issues of signal integrity that must to consider during the whole process from the schematic diagram design to PCB placement and routing.
  • Keywords
    VLSI; embedded systems; high-speed integrated circuits; integrated circuit design; microprocessor chips; signal processing; CPU; PCB placement; PCB routing; VLSI chips; circuit design method; embedded microprocessor; frequency 450 MHz; high speed IC system design; signal integrity; signal transmission; Circuit synthesis; Clocks; Couplings; Impedance; Joints; Resistors; SDRAM;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wireless Communications Networking and Mobile Computing (WiCOM), 2010 6th International Conference on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4244-3708-5
  • Electronic_ISBN
    978-1-4244-3709-2
  • Type

    conf

  • DOI
    10.1109/WICOM.2010.5600741
  • Filename
    5600741