DocumentCode
255582
Title
Review of active thermal and lifetime control techniques for power electronic modules
Author
Andresen, Markus ; Liserre, Marco ; Buticchi, Giampaolo
Author_Institution
Power Electron., Christian-Albrechts Univ. zu Kiel, Kiel, Germany
fYear
2014
fDate
26-28 Aug. 2014
Firstpage
1
Lastpage
10
Abstract
Lifetime of power electronics modules can be extended with passive methods (condition monitoring) and active ones. This paper intends to give an overview in the second category, namely active thermal control or lifetime control, offering a critical comparison based on a comprehensive reference list. Mission profiles are compared to evaluate the potential of the controllers.
Keywords
condition monitoring; power semiconductor devices; thermal management (packaging); active thermal control techniques; condition monitoring; lifetime control techniques; passive methods; power electronic modules; Cooling; Inverters; Junctions; Multichip modules; Stress; Temperature measurement; Active thermal control 2; Power cycles 3; Reliability 1; Thermal cycles 4;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics and Applications (EPE'14-ECCE Europe), 2014 16th European Conference on
Conference_Location
Lappeenranta
Type
conf
DOI
10.1109/EPE.2014.6910822
Filename
6910822
Link To Document