Title :
Review of active thermal and lifetime control techniques for power electronic modules
Author :
Andresen, Markus ; Liserre, Marco ; Buticchi, Giampaolo
Author_Institution :
Power Electron., Christian-Albrechts Univ. zu Kiel, Kiel, Germany
Abstract :
Lifetime of power electronics modules can be extended with passive methods (condition monitoring) and active ones. This paper intends to give an overview in the second category, namely active thermal control or lifetime control, offering a critical comparison based on a comprehensive reference list. Mission profiles are compared to evaluate the potential of the controllers.
Keywords :
condition monitoring; power semiconductor devices; thermal management (packaging); active thermal control techniques; condition monitoring; lifetime control techniques; passive methods; power electronic modules; Cooling; Inverters; Junctions; Multichip modules; Stress; Temperature measurement; Active thermal control 2; Power cycles 3; Reliability 1; Thermal cycles 4;
Conference_Titel :
Power Electronics and Applications (EPE'14-ECCE Europe), 2014 16th European Conference on
Conference_Location :
Lappeenranta
DOI :
10.1109/EPE.2014.6910822
