DocumentCode
2555864
Title
Silicon nitride gate ISFET fabrication based on four mask layers using standard MOSFET technology
Author
Hashim, Uda ; Arshad, Mohd Khairuddin Md ; Fatt, Chin Seng
Author_Institution
Sch. of Microelectron. Eng., Univ. Malaysia Perlis, Kangar
fYear
2008
fDate
25-27 Nov. 2008
Firstpage
626
Lastpage
628
Abstract
In this work, we present a simple fabrication method of ion sensitive field effect transistor (ISFET) using cost effective equipments in a cleanroom laboratory environment. The ISFET has a structure similar to that of a metal oxide semiconductor field effect transistor (MOSFET) except without the metal layer on top of the gate oxide and uses silicon nitride insulating layer as the ion sensing material. A conventional metal gate MOSFET technology is used to fabricate the ISFET where no extra mask or post processing step is required. This process only requires four mask layers and uses buffered hydrofluoric acid (BHF) for the etching of silicon nitride and silicon dioxide to form contact holes before metallization process. The result of this work is a simple ISFET structure with silicon nitride and silicon dioxide as the gate material.
Keywords
MOSFET; etching; ion sensitive field effect transistors; masks; semiconductor device metallisation; silicon compounds; ISFET fabrication; MOSFET; SiN; SiO2; buffered hydrofluoric acid; contact holes; etching; gate material; gate oxide; ion sensing material; ion sensitive field effect transistor; mask layers; metallization; silicon dioxide layer; silicon nitride insulating layer; Costs; Etching; FETs; Fabrication; Inorganic materials; Insulation; MOSFET circuits; Semiconductor materials; Silicon compounds; Silicon on insulator technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Electronics, 2008. ICSE 2008. IEEE International Conference on
Conference_Location
Johor Bahru
Print_ISBN
978-1-4244-3873-0
Electronic_ISBN
978-1-4244-2561-7
Type
conf
DOI
10.1109/SMELEC.2008.4770403
Filename
4770403
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