• DocumentCode
    2555864
  • Title

    Silicon nitride gate ISFET fabrication based on four mask layers using standard MOSFET technology

  • Author

    Hashim, Uda ; Arshad, Mohd Khairuddin Md ; Fatt, Chin Seng

  • Author_Institution
    Sch. of Microelectron. Eng., Univ. Malaysia Perlis, Kangar
  • fYear
    2008
  • fDate
    25-27 Nov. 2008
  • Firstpage
    626
  • Lastpage
    628
  • Abstract
    In this work, we present a simple fabrication method of ion sensitive field effect transistor (ISFET) using cost effective equipments in a cleanroom laboratory environment. The ISFET has a structure similar to that of a metal oxide semiconductor field effect transistor (MOSFET) except without the metal layer on top of the gate oxide and uses silicon nitride insulating layer as the ion sensing material. A conventional metal gate MOSFET technology is used to fabricate the ISFET where no extra mask or post processing step is required. This process only requires four mask layers and uses buffered hydrofluoric acid (BHF) for the etching of silicon nitride and silicon dioxide to form contact holes before metallization process. The result of this work is a simple ISFET structure with silicon nitride and silicon dioxide as the gate material.
  • Keywords
    MOSFET; etching; ion sensitive field effect transistors; masks; semiconductor device metallisation; silicon compounds; ISFET fabrication; MOSFET; SiN; SiO2; buffered hydrofluoric acid; contact holes; etching; gate material; gate oxide; ion sensing material; ion sensitive field effect transistor; mask layers; metallization; silicon dioxide layer; silicon nitride insulating layer; Costs; Etching; FETs; Fabrication; Inorganic materials; Insulation; MOSFET circuits; Semiconductor materials; Silicon compounds; Silicon on insulator technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Electronics, 2008. ICSE 2008. IEEE International Conference on
  • Conference_Location
    Johor Bahru
  • Print_ISBN
    978-1-4244-3873-0
  • Electronic_ISBN
    978-1-4244-2561-7
  • Type

    conf

  • DOI
    10.1109/SMELEC.2008.4770403
  • Filename
    4770403