Title :
A 60 GHz Rotman lens on a silicon wafer for system-on-a-chip and system-in-package applications
Author :
Lee, Woosung ; Kim, Jaeheung ; Cho, Choon Sik ; Yoon, Young Joong
Author_Institution :
Sch. of Electr. & Electron. Eng., Yonsei Univ., Seoul, South Korea
Abstract :
As a semiconductor microfabrication process is advanced, there are needs for implementing various components on a wafer. A 60 GHz Rotman lens on a silicon wafer has been proposed for system-on-a-chip (SoC) and system-in-package (SiP) applications. The lens was fabricated on a high resistivity silicon wafer in semiconductor process. The lens has five beam ports and seven array ports. It was observed from the measurement that the phase and the amplitude of the Rotman lens are well distributed. The beam patterns were synthesized from the measured S-parameters. The beam directions are plusmn30deg plusmn16deg, and 0deg, and the half power beam width are 15.37deg, 14.68deg, 14.53deg, 14.68deg, and 15.37deg, respectively. The feasibility of the lens on a silicon wafer has been well explored.
Keywords :
lenses; system-in-package; system-on-chip; wafer level packaging; wafer-scale integration; Rotman lens; frequency 60 GHz; high resistivity silicon wafer; semiconductor process; system-in-package application; system-on-a-chip; Application software; Conductivity; Dielectric resonator antennas; Dipole antennas; Lenses; Optical design; Radio frequency; Silicon; Space technology; System-on-a-chip; Rotman lens; SiP; SoP; high resistivity silicon wafer;
Conference_Titel :
Microwave Symposium Digest, 2009. MTT '09. IEEE MTT-S International
Conference_Location :
Boston, MA
Print_ISBN :
978-1-4244-2803-8
Electronic_ISBN :
0149-645X
DOI :
10.1109/MWSYM.2009.5165915