System design for junction temperatures up to 200°C

Manufacturers of power semiconductors and modules intend to rate the maximum junction temperature up to 200°C. This results in higher temperatures at other components of the inverter system as well. In this paper, it is presented a method to identify thermal constraints in an inverter design by combining analytical and numerical analysis of the thermal spreading. Furthermore, an overview of the thermal limits of the inverter´s components is given. The resulting thermal constraints of an air-cooled system are discussed, and it is introduced an inverter design to avoid over-temperatures. Finally, the test results achieved from the constructed inverter at 200°C junction temperature are presented.