Title :
Miss-Tuned Envelope Injection for 2.1GHz HPA Based on Polynomial Model
Author :
Liu, Youjiang ; Liu, Yinong ; Zhou, Banghua
Author_Institution :
Dept. of Eng. Phys., Tsinghua Univ., Beijing, China
Abstract :
A linearization circuitry of miss-tuned envelope injection (MTEI) method is proposed to eliminate intermodulation distortion (IMD) and memory effects of power amplifier (PA). A novel analysis approach using PA polynomial model to analyze its validity is proposed. By injecting both envelope signal and faded two-tones with their IMD products into original two-tone signal, PA´s IMD components can be cancelled out, which can overcome the drawback of high power input limit for traditional envelope injection. Two circuitry structures are presented: Direct Envelope Injection (DEI) and Forward Miss-tuned Envelope Injection (FMTEI) structures. Simulation results for 2.1GHz PA show that at 33dBm output, -73dBc and -89dBc third-order IMD suppression (IMD3) can be achieved for DEI and FMTEI respectively, which are 35dB and 51dB better than that without linearization. For FMTEI, amplitude domain compensation for IMD3 shows a broad dynamic output range of 30dBm~50dBm. Frequency domain compensation for IMD3 shows a good memory effects cancellation compared with an RF analog predistorter. The 16-QAM signal application shows 11dB~12dB ACPR improvement with FMTEI.
Keywords :
UHF power amplifiers; interference suppression; intermodulation distortion; linearisation techniques; polynomials; quadrature amplitude modulation; HPA; IMD3; PA polynomial model; QAM signal application; amplitude domain compensation; direct envelope injection; forward miss-tuned envelope injection; frequency 2.1 GHz; intermodulation distortion elimination; linearization circuitry; power amplifier; third-order IMD suppression; Frequency modulation; Integrated circuit modeling; Polynomials; Power amplifiers; Power generation; Radio frequency;
Conference_Titel :
Wireless Communications Networking and Mobile Computing (WiCOM), 2010 6th International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-3708-5
Electronic_ISBN :
978-1-4244-3709-2
DOI :
10.1109/WICOM.2010.5600782