Heatsink radiation as a function of geometry

Author

Brench, Colin E.

Author_Institution

Digital Equipment Corp., Maynard, MA, USA

fYear

1994

fDate

22-26 Aug 1994

Firstpage

105

Lastpage

109

Abstract

In today´s high performance computers the need to cool the CPU and other VLSI devices with attached heatsinks is very common. The heatsink geometry is usually driven by the thermal requirements in conjunction with the device packaging needs. As the processor speeds increase the die power dissipation also increases, leading to an increase in the preferred heatsink size. In this paper the variations in the radiation characteristics of heatsinks are examined with respect to their geometries by use of a three dimensional finite difference time domain (FDTD) technique

Keywords

VLSI; electromagnetic interference; finite difference time-domain analysis; heat sinks; packaging; 3D FDTD; CPU; VLSI devices; die power dissipation; finite difference time domain; heatsink geometry; heatsink radiation characteristics; heatsink size; high performance computers; packaging; processor speeds; thermal requirements; Assembly; Central Processing Unit; Finite difference methods; Geometry; High performance computing; Packaging machines; Power dissipation; Slabs; Time domain analysis; Very large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 1994. Symposium Record. Compatibility in the Loop., IEEE International Symposium on

Conference_Location

Chicago, IL

Print_ISBN

0-7803-1398-4

Type

conf

DOI

10.1109/ISEMC.1994.385675

Filename

385675