Fabrication of 10 Gbps laser diode module using laser welding technique

Author

Kang, S.G. ; Song, M.K. ; Park, S.S. ; Hwang, N. ; Lee, H.T. ; Pyun, K.E.

Author_Institution

Compound Semicond. Dept., Electron. & Telecommun. Res. Inst., Taejon, South Korea

Volume

2

fYear

1996

fDate

18-21 Nov. 1996

Firstpage

240

Abstract

The packaging of semiconductor optical devices in applications which require high coupling efficiencies as well as high reliability remains a challenging area. Especially for applications to 10 Gbps optical communication systems, module design and assembly are very important in terms of electrical, optical, and mechanical stability. In this paper, we discuss the fabrication of a 10 Gbps direct intensity modulated laser diode module using proper package design and laser welding techniques for the inhomogeneous materials of Cu-W and stainless steel (SUS304L).

Keywords

distributed feedback lasers; laser beam welding; laser reliability; modules; optical fabrication; optical fibre couplers; optical transmitters; semiconductor device packaging; semiconductor device reliability; semiconductor lasers; 10 Gbit/s; Cu-W; PBH-DFB single mode laser diodes; SUS304L; direct intensity modulated laser diode module; electrical stability; eye diagram; high coupling efficiencies; high reliability; inhomogeneous materials; laser diode module fabrication; laser welding technique; mechanical stability; module design; optical communication systems; optical fiber coupling; optical stability; semiconductor optical device packaging; Diode lasers; Optical coupling; Optical design; Optical device fabrication; Optical devices; Optical fiber communication; Semiconductor device packaging; Semiconductor device reliability; Semiconductor lasers; Welding;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics Society Annual Meeting, 1996. LEOS 96., IEEE

Conference_Location

Boston, MA, USA

Print_ISBN

0-7803-3160-5

Type

conf

DOI

10.1109/LEOS.1996.571642

Filename

571642