DocumentCode
2556859
Title
A preliminary investigation of the kinetics of post-oxidation anneal induced E´-precursor formation
Author
Conley, J.F. ; Lenahan, P.M. ; McArthur, W.F.
Author_Institution
Commercial Syst., Dynamics Res. Corp., Beaverton, OR, USA
fYear
1998
fDate
12-15 Oct 1998
Firstpage
62
Lastpage
67
Abstract
Detailed knowledge of the underlying defect mechanisms that dominate MOS device reliability is essential for the development of predictive models for semiconductor technology computer-aided-design (TCAD). In this paper, we discuss a preliminary extension our earlier E´-model of hole trap precursor formation in SiO2. Our results, at least qualitatively, show that a kinetic component can be added to extend the thermodynamics-based E´ model of oxide hole trapping. Measurements of the growth of E´ precursor density and hole trap precursor density vs. post-oxidation-anneal time reveal that both E´ and hole trap density approach saturation values and that the approach to these saturation values is more rapid at higher temperatures. The results indicate strongly that a thermodynamics approach to oxide hole trap precursor modeling is appropriate, i.e., the relevant defect densities approach thermodynamic equilibrium or quasi-equilibrium in reasonable times. Since E´ centers are suspected of playing a role in time dependent dielectric breakdown, stress induced leakage currents, and other reliability problems, a process dependent predictive knowledge of E´ density could potentially provide information about oxide performance and reliability without the need for extensive testing
Keywords
MIS devices; annealing; hole traps; oxidation; semiconductor device models; semiconductor device reliability; E´ defect center; MOS device; SiO2; kinetics; oxide hole trap; post-oxidation annealing; precursor formation; predictive model; reliability; semiconductor TCAD; stress induced leakage current; thermodynamic equilibrium; time dependent dielectric breakdown; Density measurement; Dielectric breakdown; Kinetic theory; Leakage current; MOS devices; Predictive models; Semiconductor device reliability; Temperature; Thermal stresses; Thermodynamics;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 1998. IEEE International
Conference_Location
Lake Tahoe, CA
Print_ISBN
0-7803-4881-8
Type
conf
DOI
10.1109/IRWS.1998.745369
Filename
745369
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