Title :
A preliminary investigation of the kinetics of post-oxidation anneal induced E´-precursor formation
Author :
Conley, J.F. ; Lenahan, P.M. ; McArthur, W.F.
Author_Institution :
Commercial Syst., Dynamics Res. Corp., Beaverton, OR, USA
Abstract :
Detailed knowledge of the underlying defect mechanisms that dominate MOS device reliability is essential for the development of predictive models for semiconductor technology computer-aided-design (TCAD). In this paper, we discuss a preliminary extension our earlier E´-model of hole trap precursor formation in SiO2. Our results, at least qualitatively, show that a kinetic component can be added to extend the thermodynamics-based E´ model of oxide hole trapping. Measurements of the growth of E´ precursor density and hole trap precursor density vs. post-oxidation-anneal time reveal that both E´ and hole trap density approach saturation values and that the approach to these saturation values is more rapid at higher temperatures. The results indicate strongly that a thermodynamics approach to oxide hole trap precursor modeling is appropriate, i.e., the relevant defect densities approach thermodynamic equilibrium or quasi-equilibrium in reasonable times. Since E´ centers are suspected of playing a role in time dependent dielectric breakdown, stress induced leakage currents, and other reliability problems, a process dependent predictive knowledge of E´ density could potentially provide information about oxide performance and reliability without the need for extensive testing
Keywords :
MIS devices; annealing; hole traps; oxidation; semiconductor device models; semiconductor device reliability; E´ defect center; MOS device; SiO2; kinetics; oxide hole trap; post-oxidation annealing; precursor formation; predictive model; reliability; semiconductor TCAD; stress induced leakage current; thermodynamic equilibrium; time dependent dielectric breakdown; Density measurement; Dielectric breakdown; Kinetic theory; Leakage current; MOS devices; Predictive models; Semiconductor device reliability; Temperature; Thermal stresses; Thermodynamics;
Conference_Titel :
Integrated Reliability Workshop Final Report, 1998. IEEE International
Conference_Location :
Lake Tahoe, CA
Print_ISBN :
0-7803-4881-8
DOI :
10.1109/IRWS.1998.745369