DocumentCode
2556960
Title
Monitoring charging in high current ion implanters yields optimum preventive maintenance schedules and procedures
Author
Gonzalez, Henry ; Reno, Steve ; Messick, Cleston ; Lukaszek, Wes ; Romanski, Thomas
Author_Institution
Fairchild Semicond., West Jordan, UT, USA
fYear
1998
fDate
12-15 Oct 1998
Firstpage
82
Lastpage
85
Abstract
Gate to substrate charging during high current ion implantation correlates to gate oxide damage seen at product testing or during reliability assessment, as can be discovered by tedious statistical evaluations. However, variations in charging over time do not lend themselves to the same statistical analysis. Using CHARM(R)-2 to proactively monitor charging on a consistent basis over 12 months detected adverse trends before charging levels impacted yield or reliability. Variations in charging levels also correlated to preventive maintenance schedules, indicating a need to implement optimum timing and procedures. Trends for different implanters demonstrate the results of successfully implementing procedural changes, which reduced peak charging potentials and minimized equipment drift
Keywords
integrated circuit reliability; integrated circuit testing; integrated circuit yield; ion implantation; process monitoring; surface charging; CHARM-2; charging; equipment drift; gate oxide damage; gate-substrate charging; high current ion implanters; monitoring; optimum preventive maintenance schedules; peak charging potentials; preventive maintenance schedules; product testing; reliability assessment; statistical evaluation; yield; Dielectric losses; Electrodes; Monitoring; Plasma immersion ion implantation; Plasma materials processing; Preventive maintenance; Scheduling; Substrates; Testing; Voltage control;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 1998. IEEE International
Conference_Location
Lake Tahoe, CA
Print_ISBN
0-7803-4881-8
Type
conf
DOI
10.1109/IRWS.1998.745373
Filename
745373
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