Title :
Discussion Group Summary Interconnect Reliability - with A Focus On Copper
Author :
Sullivan, Tim ; Pierce, Don
Keywords :
Acceleration; Artificial intelligence; Copper; Electromigration; Metallization; Microelectronics; Rivers; Stress; Testing; Time measurement;
Conference_Titel :
Integrated Reliability Workshop Final Report, 1998. IEEE International
Conference_Location :
Lake Tahoe, CA, USA
Print_ISBN :
0-7803-4881-8
DOI :
10.1109/IRWS.1998.745375
