Thermally induced stresses in semiconductor laser packaging

Author

Yang, I.D. ; Wang, W.H. ; Kuang, J.H. ; Cheng, W.H.

Author_Institution

Inst. of Electro-Opt. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan

Volume

2

fYear

1996

fDate

18-21 Nov. 1996

Firstpage

242

Abstract

The thermally induced stresses in the laser welding technique for semiconductor laser packaging are calculated by using the finite-element method (FEM). Results obtained from stainless-to-Kovar joints indicate that the Kovar with an Au coating shows a higher stress than that without a coating. There is satisfactory agreement between experimental results and the finite-element predictions that the higher stresses induced by Au in Kovar during the welding process are a possible cause for surface cracks.

Keywords

finite element analysis; laser beam welding; semiconductor device packaging; semiconductor lasers; thermal stress cracking; thermal stresses; transient analysis; Au; Au coating; FEM; laser welding technique; numerical simulation; semiconductor laser packaging; stainless-to-Kovar joints; surface cracks; thermally induced stresses; transient stresses; Coatings; Computational modeling; Fiber lasers; Gold; Laser modes; Residual stresses; Semiconductor device packaging; Semiconductor lasers; Thermal stresses; Welding;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics Society Annual Meeting, 1996. LEOS 96., IEEE

Conference_Location

Boston, MA, USA

Print_ISBN

0-7803-3160-5

Type

conf

DOI

10.1109/LEOS.1996.571643

Filename

571643