DocumentCode :
2557198
Title :
The analysis of oxide reliability data
Author :
Hunter, William R.
Author_Institution :
Silicon Technol. Dev., Texas Instrum. Inc., Dallas, TX, USA
fYear :
1998
fDate :
12-15 Oct 1998
Firstpage :
114
Lastpage :
134
Abstract :
Techniques for measuring gate oxide reliability, such as TDDB, voltage ramps, and current ramps, have existed for a long time, but many of these are applied qualitatively. We discuss here detailed aspects of analysis methods which can be applied to these techniques to make absolute reliability determinations. Along the way, we discuss important aspects such as failure rate based methodologies, band-bending corrections to measured gate voltages, active gate oxide area scaling, and quasi-static lifetime transformations
Keywords :
electric breakdown; integrated circuit reliability; TDDB; active gate oxide area scaling; band-bending corrections; current ramps; failure rate; gate oxide reliability; gate voltage; quasi-static lifetime transformations; voltage ramps; Breakdown voltage; Current measurement; Fluctuations; Instruments; Log-normal distribution; Monte Carlo methods; Probability distribution; Silicon; Time measurement; Weibull distribution;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 1998. IEEE International
Conference_Location :
Lake Tahoe, CA
Print_ISBN :
0-7803-4881-8
Type :
conf
DOI :
10.1109/IRWS.1998.745384
Filename :
745384
Link To Document :
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