Title :
The analysis of oxide reliability data
Author :
Hunter, William R.
Author_Institution :
Silicon Technol. Dev., Texas Instrum. Inc., Dallas, TX, USA
Abstract :
Techniques for measuring gate oxide reliability, such as TDDB, voltage ramps, and current ramps, have existed for a long time, but many of these are applied qualitatively. We discuss here detailed aspects of analysis methods which can be applied to these techniques to make absolute reliability determinations. Along the way, we discuss important aspects such as failure rate based methodologies, band-bending corrections to measured gate voltages, active gate oxide area scaling, and quasi-static lifetime transformations
Keywords :
electric breakdown; integrated circuit reliability; TDDB; active gate oxide area scaling; band-bending corrections; current ramps; failure rate; gate oxide reliability; gate voltage; quasi-static lifetime transformations; voltage ramps; Breakdown voltage; Current measurement; Fluctuations; Instruments; Log-normal distribution; Monte Carlo methods; Probability distribution; Silicon; Time measurement; Weibull distribution;
Conference_Titel :
Integrated Reliability Workshop Final Report, 1998. IEEE International
Conference_Location :
Lake Tahoe, CA
Print_ISBN :
0-7803-4881-8
DOI :
10.1109/IRWS.1998.745384