• DocumentCode
    2557198
  • Title

    The analysis of oxide reliability data

  • Author

    Hunter, William R.

  • Author_Institution
    Silicon Technol. Dev., Texas Instrum. Inc., Dallas, TX, USA
  • fYear
    1998
  • fDate
    12-15 Oct 1998
  • Firstpage
    114
  • Lastpage
    134
  • Abstract
    Techniques for measuring gate oxide reliability, such as TDDB, voltage ramps, and current ramps, have existed for a long time, but many of these are applied qualitatively. We discuss here detailed aspects of analysis methods which can be applied to these techniques to make absolute reliability determinations. Along the way, we discuss important aspects such as failure rate based methodologies, band-bending corrections to measured gate voltages, active gate oxide area scaling, and quasi-static lifetime transformations
  • Keywords
    electric breakdown; integrated circuit reliability; TDDB; active gate oxide area scaling; band-bending corrections; current ramps; failure rate; gate oxide reliability; gate voltage; quasi-static lifetime transformations; voltage ramps; Breakdown voltage; Current measurement; Fluctuations; Instruments; Log-normal distribution; Monte Carlo methods; Probability distribution; Silicon; Time measurement; Weibull distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report, 1998. IEEE International
  • Conference_Location
    Lake Tahoe, CA
  • Print_ISBN
    0-7803-4881-8
  • Type

    conf

  • DOI
    10.1109/IRWS.1998.745384
  • Filename
    745384