DocumentCode
255723
Title
Thermal management details and their influence on the aging of power semiconductors
Author
Schulz, Markus
Author_Institution
Infineon Technol., Warstein, Germany
fYear
2014
fDate
26-28 Aug. 2014
Firstpage
1
Lastpage
6
Abstract
The major factor defining the wear and tear in power electronic components is temperature swing. The paper presents an insight to failure mechanisms and the benefits that can be gained if a holistic approach considering devices, adequate design-in and advanced thermal management is considered.
Keywords
ageing; power semiconductor devices; semiconductor device packaging; semiconductor device reliability; thermal management (packaging); wear; aging; power electronic components; power semiconductors; temperature swing; thermal management; Copper; Heat sinks; Materials; Multichip modules; Soldering; Stress; Wires; Power Semiconductor Device; Reliability; Robustness; Thermal Design;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics and Applications (EPE'14-ECCE Europe), 2014 16th European Conference on
Conference_Location
Lappeenranta
Type
conf
DOI
10.1109/EPE.2014.6910898
Filename
6910898
Link To Document