Title :
Thermal management details and their influence on the aging of power semiconductors
Author_Institution :
Infineon Technol., Warstein, Germany
Abstract :
The major factor defining the wear and tear in power electronic components is temperature swing. The paper presents an insight to failure mechanisms and the benefits that can be gained if a holistic approach considering devices, adequate design-in and advanced thermal management is considered.
Keywords :
ageing; power semiconductor devices; semiconductor device packaging; semiconductor device reliability; thermal management (packaging); wear; aging; power electronic components; power semiconductors; temperature swing; thermal management; Copper; Heat sinks; Materials; Multichip modules; Soldering; Stress; Wires; Power Semiconductor Device; Reliability; Robustness; Thermal Design;
Conference_Titel :
Power Electronics and Applications (EPE'14-ECCE Europe), 2014 16th European Conference on
Conference_Location :
Lappeenranta
DOI :
10.1109/EPE.2014.6910898
