Overview and Status of Numerical Electromagnetic Field Simulation Methods Applied to Integrated Circuits

Author

Russer, Peter ; Bajon, Damienne ; Wane, Sidina ; Fichtner, Nikolaus

Author_Institution

Inst. for High-Freq. Eng., Tech. Univ. Munchen, Munich

fYear

2009

fDate

19-21 Jan. 2009

Firstpage

1

Lastpage

8

Abstract

We give a presentation on numerical electromagnetic field simulation methods applied to integrated circuits and discuss challenges of chip, package and board co- design. Different modeling techniques are introduced where especially the application and need for hybrid methods is stressed. Also the need for global methodologies in simulating digital and analog signal behavior of ICs is discussed and illustrated by real system-in-package (SiP) examples.

Keywords

electromagnetic fields; integrated circuit modelling; monolithic integrated circuits; system-on-package; IC analog signal simulation; IC digital signal simulation; chip-package-board co-design; electromagnetic field simulation methods; integrated circuits; system-in-package; Circuit simulation; Electromagnetic fields; Frequency; Germanium silicon alloys; Integrated circuit technology; MMICs; Numerical simulation; Power transmission lines; Silicon germanium; Transmission line matrix methods;

fLanguage

English

Publisher

ieee

Conference_Titel

Silicon Monolithic Integrated Circuits in RF Systems, 2009. SiRF '09. IEEE Topical Meeting on

Conference_Location

San Diego, CA

Print_ISBN

978-1-4244-3940-9

Electronic_ISBN

978-1-4244-2831-1

Type

conf

DOI

10.1109/SMIC.2009.4770510

Filename

4770510