Title :
InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V
fDate :
May 29 1996-June 1 1996
Abstract :
The following topics were dealt with: issues related to portable electronics; reliable designs; air cooled heat sinks; ball grid arrays; computational evaluations; integrated design techniques; liquid cooling
Keywords :
cooling; heat sinks; integrated circuit design; integrated circuit packaging; integrated circuit reliability; plastic packaging; printed circuits; air cooled heat sinks; ball grid arrays; computational evaluations; electronic systems; integrated design techniques; liquid cooling; portable electronics; reliable designs; thermal phenomena;
Conference_Titel :
Thermal Phenomena in Electronic Systems, 1996. I-THERM V., Inter-Society Conference on
Conference_Location :
Orlando, FL, USA
Print_ISBN :
0-7803-3325-X
DOI :
10.1109/ITHERM.1996.534538
