Coupled numerical and field-theoretical computation of the effects of circuit-package interactions on the linear and nonlinear performance of active MMIC´s

Author

Rizzoli, Vittorio ; Masotti, Diego ; Costanzo, Alessandra ; Arbizzani, Nicola

Author_Institution

DEIS, Univ. di Bologna, Bologna, Italy

fYear

2009

fDate

7-12 June 2009

Firstpage

1481

Lastpage

1484

Abstract

The linear and nonlinear performance of packaged active microwave circuits is evaluated by a novel technique based on a combination of EM theory and numerical analysis. The metal enclosure is treated as a scatterer that radiates back the incident field generated by the unpackaged circuit, and the effects of such scattered field on circuit performance are evaluated by the reciprocity theorem. The results compare favorably with those produced by FEM and FDTD/FIT methods.

Keywords

MMIC; active networks; computational electromagnetics; electronics packaging; finite difference time-domain analysis; finite element analysis; EM theory; FDTD-FIT method; FEM; active MMIC; circuit-package interaction effect; field-theoretical computation; finite difference time-domain analysis; finite element analysis; incident field; metal enclosure; numerical analysis; packaged active microwave circuit; Analytical models; Circuit analysis computing; Circuit simulation; Coupling circuits; Finite difference methods; Microwave circuits; Numerical analysis; Packaging; Scattering; Time domain analysis; Nonlinear circuits; distortion; electromagnetic simulation; packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 2009. MTT '09. IEEE MTT-S International

Conference_Location

Boston, MA

ISSN

0149-645X

Print_ISBN

978-1-4244-2803-8

Electronic_ISBN

0149-645X

Type

conf

DOI

10.1109/MWSYM.2009.5165988

Filename

5165988