• DocumentCode
    2557677
  • Title

    SF6 gas breakdown at low temperature

  • Author

    Fréchette, Michel F.

  • Author_Institution
    IREQ, Varennes, Que., Canada
  • fYear
    1990
  • fDate
    3-6 Jun 1990
  • Firstpage
    229
  • Lastpage
    235
  • Abstract
    The low-temperature breakdown behavior of compressed SF6 is reviewed, the scope of the investigation being limited by experimental conditions which correspond to a gas state of the insulating medium. A thermodynamic model has been developed taking into account the nonideal gas behavior associated with compressed gas conditions and a low-temperature environment. The accuracy of the thermodynamic model was checked successfully by comparing predicted and measured dew points for SF6 and mixtures with N2. A brief analytical review of a rather sparse set of low-temperature breakdown data in SF6 shows that the low-temperature environment has a definite effect on gas-breakdown behavior; in some circumstances, the effect is large enough to require practical modifications. Some of the data obtained are analyzed in the framework of compressed-gas discharge phenomenology in order to link this temperature dependence of breakdown with some underlying active mechanisms
  • Keywords
    electric breakdown of gases; gas mixtures; gaseous insulation; nitrogen; sulphur compounds; SF6 gas breakdown; SF6-N2 mixtures; active mechanisms; compressed SF6; compressed gas conditions; compressed-gas discharge phenomenology; dew points; gas state; gas-breakdown behavior; low-temperature breakdown behavior; low-temperature breakdown data; low-temperature environment; nonideal gas behavior; temperature dependence of breakdown; thermodynamic model; Atmosphere; Circuit testing; Data analysis; Electric breakdown; Equations; Occupational stress; Phase measurement; Sulfur hexafluoride; Temperature distribution; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 1990., Conference Record of the 1990 IEEE International Symposium on
  • Conference_Location
    Toronto, Ont.
  • ISSN
    1089-084X
  • Type

    conf

  • DOI
    10.1109/ELINSL.1990.109747
  • Filename
    109747