• DocumentCode
    2557792
  • Title

    Performance of aluminum distribution-cable splices under accelerated aging

  • Author

    Dang, C. ; Trinh, N.G. ; Lamarre, L.

  • Author_Institution
    IREQ, Varennes, Que., Canada
  • fYear
    1990
  • fDate
    3-6 Jun 1990
  • Firstpage
    261
  • Lastpage
    267
  • Abstract
    A series of accelerated aging experiments was carried out on two generic types of cable splice (heat-shrinkable and premolded) for underground distribution systems. Each accelerated aging experiment consisted of a daily heat cycle and a selected stress voltage. Testing was performed until sample failure and the time-to-failure were recorded to assess the performance of the splice under test. The results demonstrate that aging experiments are an effective means to bring out design weaknesses in both heat-shrinkable and premolded splices. Thermal instabilities at the splice connector were found to be the principal cause of failure in both types of splice when operated at high temperatures. In addition, workmanship can greatly influence the expected performance of the heat-shrinkable splice in its present design. By comparison, the premolded splice tested is more susceptible to mechanical stresses
  • Keywords
    ageing; aluminium; cable jointing; failure analysis; life testing; power cables; underground cables; underground distribution systems; Al-Al distribution cable splices; accelerated aging experiments; cause of failure; daily heat cycle; design weakness detection; failure analysis; generic types of cable splice; heat-shrinkable splice; load cycling; mechanical stresses; operated at high temperatures; premolded splices; splice connector; stress voltage; test to failure; thermal instabilities; time-to-failure; underground distribution systems; workmanship; Accelerated aging; Aluminum; Conductors; Connectors; Corona; Manufacturing; Power cables; Quality control; Temperature; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 1990., Conference Record of the 1990 IEEE International Symposium on
  • Conference_Location
    Toronto, Ont.
  • ISSN
    1089-084X
  • Type

    conf

  • DOI
    10.1109/ELINSL.1990.109752
  • Filename
    109752