DocumentCode
2558486
Title
Compact quintplexer module with meshed ground plane for US-CDMA handset applications
Author
Bang, Dong H. ; Cheon, Seong J. ; Park, Jae Y.
Author_Institution
Dept. of Electron. Eng., Kwangwoon Univ., Seoul, South Korea
fYear
2009
fDate
7-12 June 2009
Firstpage
1629
Lastpage
1632
Abstract
Compact quintplexer module with PCB embedded passive triplexer circuit has been designed and fabricated for US-CDMA handset applications. Meshed ground technology was newly applied to improve the quality factor of the embedded inductors for reducing the insertion loss of the quintplexer module. The proposed quintplexer module was comprised of passive triplexer, SAW duplexer for DCN band, and FBAR duplexer for US-PCS band. The passive triplexer circuit with 8 passive elements was comprised of a diplexer, parallel resonator, and matching network. A fabricated quintplexer module with meshed ground plane exhibited insertion losses of -2.2 dB/-2.8 dB at DCN Tx/Rx band, -2.8 dB/-3.2 dB at US-PCS Tx/Rx band, and -1.2 dB at GPS Rx band, respectively. In addition, the stop-band attenuation performances are -50 dB/-50 dB at DCN Tx/Rx band, -52 dB/-42 dB at PCS Tx/Rx band, and -35 dB at GPS Rx band, respectively. The applied meshed ground plane was confirmed to be effective for improving the quality factors of the embedded inductors resulting in low insertion loss and high isolation characteristics of the embedded triplexer circuit.
Keywords
Q-factor; code division multiple access; inductors; mobile handsets; multiplexing equipment; printed circuits; DCN band; FBAR duplexer; PCB embedded passive triplexer circuit; SAW duplexer; US-CDMA handset applications; US-PCS band; compact quintplexer module; diplexer; loss -1.2 dB; loss -2.2 dB; loss -2.8 dB; loss -3.2 dB; matching network; meshed ground plane; parallel resonator; stop-band attenuation; Attenuation; Circuits; Film bulk acoustic resonators; Global Positioning System; Inductors; Insertion loss; Personal communication networks; Q factor; Surface acoustic waves; Telephone sets; Front-end module; PCB embedded; SOP based; US-CDMA; passive triplexer; quintplexer;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 2009. MTT '09. IEEE MTT-S International
Conference_Location
Boston, MA
ISSN
0149-645X
Print_ISBN
978-1-4244-2803-8
Electronic_ISBN
0149-645X
Type
conf
DOI
10.1109/MWSYM.2009.5166025
Filename
5166025
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