• DocumentCode
    2558604
  • Title

    Experimental and numerical study on natural convection from upward horizontal rectangular grooved fins

  • Author

    Kwak, Chang-eop ; Song, Tae-Ho

  • Author_Institution
    Dept. of Mech. Eng., Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea
  • fYear
    1996
  • fDate
    29 May-1 Jun 1996
  • Firstpage
    38
  • Lastpage
    45
  • Abstract
    Natural convection from two-dimensional upward horizontal rectangular grooved fins was studied experimentally and numerically. A Mach-Zehnder interferometer was used in the experiment and the local Nusselt numbers on each surface (outer, left, bottom, and right surfaces) of the grooves were measured quantitatively by analyzing the interferograms. In some cases (grooves of some aspect ratios in low Grashof number), the total heat transfer rate from the grooved surface is even smaller than that from a non-grooved surface though the surface area is greater; care should be practised to avoid such cases. As revealed by the numerical analysis, a secondary recirculation flow is frequently found in the groove. It prevents the main flow from flowing into the groove. When this happens, the heat transfer rate from the inner surfaces is significantly smaller than that from the outer surface. The results have been compressed by the Nu vs. Gr correlations and they give an important guideline for selecting proper aspect ratio and dimensions for upward horizontal grooved fins
  • Keywords
    Mach-Zehnder interferometers; cooling; natural convection; packaging; Grashof number; Mach-Zehnder interferometer; aspect ratios; grooved surface; heat transfer rate; local Nusselt numbers; natural convection; nongrooved surface; secondary recirculation flow; upward horizontal rectangular grooved fins; Boundary conditions; Electronic components; Electronic equipment; Electronics cooling; Heat transfer; Immersion cooling; Indirect liquid cooling; Numerical analysis; Reliability; Visualization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Phenomena in Electronic Systems, 1996. I-THERM V., Inter-Society Conference on
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    0-7803-3325-X
  • Type

    conf

  • DOI
    10.1109/ITHERM.1996.534543
  • Filename
    534543