Title :
Silicon-based, low-g microelectromechanical systems inertial switch for linear acceleration sensing application
Author :
Zhuang Xiong ; Fengtian Zhang ; Yingdong Pu ; Bin Tang ; Jie Yang ; Chao Wang
Author_Institution :
Inst. of Electron. Eng., China Acad. of Eng. Phys., Mianyang, China
Abstract :
Most of the microelectromechanical systems inertial switches developed in recent years are intended for shock and impact sensing above 40 g. These switches are fabricated based on non-silicon surface micromachining with multiple steps of electroplating. In this reported work, a silicon-based low-g inertial switch typically used for linear acceleration sensing was conceived, designed and fabricated. The developed inertial switch consists of a high volume proof mass and low stiffness spiral spring, and is fabricated in a specially designed double-buried layer silicon-on-insulator wafer, with standard silicon micromachining. The measurement results show that the threshold value is about 7.42 g and the stiffness is about 1.5 N/m, in accordance with the finite element method calculation.
Keywords :
electroplating; elemental semiconductors; finite element analysis; micromachining; microswitches; silicon; Si; electroplating; finite element method calculation; impact sensing; linear acceleration sensing; microelectromechanical systems inertial switch; non-silicon surface micromachining; shock sensing; silicon micromachining; silicon-based low-g inertial switch; silicon-on-insulator wafer;
Journal_Title :
Micro & Nano Letters, IET
DOI :
10.1049/mnl.2015.0059