DocumentCode
2558766
Title
Test wafer control system in 300 mm FAB
Author
Hsu, Jer-Wei ; Lo, Hsi-Lo ; Pan, Cheng-Chung ; Chen, Yi-Ming ; Hsieh, Teng-Ko
Author_Institution
Powerchip Semicond. Corp., Hsinchu, Taiwan
fYear
2004
fDate
9-10 Sept. 2004
Firstpage
33
Lastpage
36
Abstract
Test wafers are used in wafer fabrication to monitor equipment stability and product quality. Any shortage causes the loss of equipment capacity and production move. On the contrary, to prepare more test wafers to avoid shortage spends more cost, occupies more storage space, and lowers transfer efficiency. Considering the wafer cost and FAB productivity, an efficient control system of test wafer in 300 mm FAB is much more important than formerly.
Keywords
costing; integrated circuit testing; process control; process monitoring; quality management; semiconductor device manufacture; stability; 300 mm; FAB productivity; equipment stability; product quality; test wafer control system; wafer cost; wafer fabrication; Automatic control; Automation; Control systems; Costs; Dispatching; Real time systems; Recycling; Safety; Surface cleaning; System testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing Technology Workshop Proceedings, 2004
Print_ISBN
0-7803-8469-5
Type
conf
DOI
10.1109/SMTW.2004.1393710
Filename
1393710
Link To Document