DocumentCode :
2558766
Title :
Test wafer control system in 300 mm FAB
Author :
Hsu, Jer-Wei ; Lo, Hsi-Lo ; Pan, Cheng-Chung ; Chen, Yi-Ming ; Hsieh, Teng-Ko
Author_Institution :
Powerchip Semicond. Corp., Hsinchu, Taiwan
fYear :
2004
fDate :
9-10 Sept. 2004
Firstpage :
33
Lastpage :
36
Abstract :
Test wafers are used in wafer fabrication to monitor equipment stability and product quality. Any shortage causes the loss of equipment capacity and production move. On the contrary, to prepare more test wafers to avoid shortage spends more cost, occupies more storage space, and lowers transfer efficiency. Considering the wafer cost and FAB productivity, an efficient control system of test wafer in 300 mm FAB is much more important than formerly.
Keywords :
costing; integrated circuit testing; process control; process monitoring; quality management; semiconductor device manufacture; stability; 300 mm; FAB productivity; equipment stability; product quality; test wafer control system; wafer cost; wafer fabrication; Automatic control; Automation; Control systems; Costs; Dispatching; Real time systems; Recycling; Safety; Surface cleaning; System testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing Technology Workshop Proceedings, 2004
Print_ISBN :
0-7803-8469-5
Type :
conf
DOI :
10.1109/SMTW.2004.1393710
Filename :
1393710
Link To Document :
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