Effect of component layout and geometry on the flow distribution in electronics circuit packs

Author

Azar, Kaveh ; Russell, Ellsworth T.

Author_Institution

AT&T Bell Lab., Ward Hill, MA, USA

fYear

1990

fDate

6-8 Feb 1990

Firstpage

1

Lastpage

9

Abstract

An experiment conducted in a water tunnel using aluminium blocks to simulate various electronic components is discussed. The experiments were conducted for laminar and onset of transition Reynolds numbers. Diluted ink was used as the flow visualization vehicle. Flow over a single component, multiple components, and fully loaded circuit packs was studied. The flows were found to be highly three-dimensional, and it is concluded that the the location and orientation of components with large aspect ratio will significantly affect circuit pack flow distribution

Keywords

cooling; flow visualisation; printed circuit design; 3D flow; IC package simulation; air cooled circuit packs; circuit pack flow distribution; component geometry; component layout; component location; dilute ink; electronics cooling; flow distribution in electronics circuit packs; flow visualization; fully loaded circuit packs; laminal flow; large aspect ratio; multiple components; orientation of components; single component; transition Reynolds numbers; water tunnel; Aluminum; Circuit simulation; Electronic circuits; Electronic components; Electronics cooling; Geometry; Heat transfer; Ink; Vehicles; Visualization;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal and Temperature Measurement Symposium, 1990. SEMI-THERM VI, Proceedings., Sixth Annual IEEE

Conference_Location

Phoenix, AZ

Type

conf

DOI

10.1109/STHERM.1990.68482

Filename

68482