• DocumentCode
    2558903
  • Title

    Inter-firm collaboration mechanism in process development and product design between foundry and fabless design house

  • Author

    Su, Yea-Huey ; Guo, Ruey-Shan ; Chang, Shi-Chung

  • Author_Institution
    Nat. Central Univ., Chung-li, Taiwan
  • fYear
    2004
  • fDate
    9-10 Sept. 2004
  • Firstpage
    47
  • Lastpage
    50
  • Abstract
    As IC design and manufacturing complexities continue to increase exponentially, new collaboration mechanisms are required between IC design house and foundry. By conducting field interviews and empirical study, this research summarizes different engineering collaboration mechanisms under different stages of process technology. There are several findings: 1) The collaboration is mostly required when the design house develops advanced products and the foundry needs driving product house develop advanced processes; 2) The major effort of collaboration in advanced and developing processes is to find the critical failure modes in order to dramatically improve the yield of new process technology; 3) It is critical to have right experts from both parties; and 4) The migration from low yield toward high yield requires improvement through both product design tuning and process tuning. Partnership and close interactions are required for quick problem solving.
  • Keywords
    foundries; integrated circuit design; integrated circuit manufacture; product design; product development; IC design; fabless design house; foundry; integrated circuit manufacturing; interfirm collaboration mechanism; problem solving; process development; process technology; process tuning; product design; product design tuning; Collaboration; Electronics industry; Foundries; Information management; Logistics; Manufacturing processes; Problem-solving; Product design; Semiconductor device manufacture; Virtual manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing Technology Workshop Proceedings, 2004
  • Print_ISBN
    0-7803-8469-5
  • Type

    conf

  • DOI
    10.1109/SMTW.2004.1393715
  • Filename
    1393715