A pressure-balanced electrostatically-actuated microvalve

Author

Huff, M.A. ; Mettner, M.S. ; Lober, T.A. ; Schmidt, M.A.

Author_Institution

Microsyst. Technol. Lab., MIT, Cambridge, MA, USA

fYear

1990

fDate

4-7 June 1990

Firstpage

123

Lastpage

127

Abstract

A new microvalve structure designed to enhance the limited actuation forces available in microfabricated devices by using a pressure-balancing scheme is reported. The concept is to allow the fluid to provide a balancing force on the moving part of the device, thereby reducing the force required to open the valve. Various methods can be used to actuate the valve, but electrostatic actuation is chosen since it is readily integrated with the valve fabrication sequence. The process for implementing the valve concept uses multiple wafer bonding steps (three in the present prototype) and has yielded valves which have been successfully actuated in air using voltages below 350 V.<>

Keywords

electric actuators; electrohydraulic control equipment; micromechanical devices; valves; actuation forces; electrostatic actuation; electrostatically-actuated microvalve; microfabricated devices; multiple wafer bonding steps; pressure-balancing scheme; Electrostatic actuators; Etching; Fabrication; Microvalves; Nickel; Prototypes; Silicon; Valves; Voltage; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensor and Actuator Workshop, 1990. 4th Technical Digest., IEEE

Conference_Location

Hilton Head Island, SC, USA

Type

conf

DOI

10.1109/SOLSEN.1990.109835

Filename

109835