DocumentCode
2560070
Title
ESD in the manufacture, assembly, test, delivery, operation, and repair of distribution control system components
Author
Kleinhample, Richard
Author_Institution
ABB Ind. Syst. Inc., New Berlin, WI, USA
fYear
1990
fDate
18-22 Jun 1990
Firstpage
92
Lastpage
101
Abstract
The causes of ESD (electrostatic discharge) and its effects on electrical and electronic parts are examined, and ESD protective materials and equipment are discussed. Issues discussed include IC protection, the effects of surface charge density, protective transport packaging, the protective environments, and CMOS latchup. It is also concluded that everyone involved in processing, assembly, inspection, handling, packaging, shipping, storage, stowage, testing, installation, and maintenance of susceptible parts throughout the equipment life cycle, both at the manufacturer´s and the user´s facility, needs to be aware of the damage that can be done to ESD sensitive parts, and should be trained on how to control their environment to minimize the potential for damage
Keywords
CMOS integrated circuits; digital control; distributed control; electrostatic discharge; integrated circuit technology; microcomputer applications; CMOS latchup; ESD; IC protection; assembly; delivery; digital control; distribution control system components; electrostatic discharge; inspection; installation; maintenance; manufacture; microprocessors; operation; protective materials; protective transport packaging; repair; surface charge density; testing; Assembly; CMOS integrated circuits; Electronic equipment manufacture; Electronics packaging; Electrostatic discharge; Manufacturing; Packaging machines; Protection; Surface discharges; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Pulp and Paper Industry Technical Conference, 1990., Conference Record of 1990 Annual
Conference_Location
Seattle, WA
Type
conf
DOI
10.1109/PAPCON.1990.109869
Filename
109869
Link To Document