DocumentCode :
2560231
Title :
A Fully Digital Low Cost Time Domain Smart Temperature Sensor with Extremely Tiny Size
Author :
Chen, Poki ; Shie, Mon-Chau ; Zheng, Zi-Fan ; Chu, Chun-Yan ; Chiang, Mao-Hsing ; Zheng, Zhi-Yuan
Author_Institution :
Dept. of Electron. Eng. & Grad. Inst. of Electro-Opt. Eng., Nat. Taiwan Univ. of Sci. & Technol., Taipei
fYear :
2006
fDate :
13-15 Nov. 2006
Firstpage :
147
Lastpage :
153
Abstract :
To explore the possibility of soft IP implementation, a fully digital smart temperature sensor without any full-custom device is proposed for painless VLSI or SOC on-chip integrations. The signal is processed thoroughly in time domain instead of conventional voltage or current domain. A cyclic delay line is used to generate the thermally sensitive pulse with a width proportional to the measured temperature. The timing reference is just the input clock, and a counter instead of voltage or current analog-to-digital converter is utilized for digital output coding. The circuit is realized by FPGA chips for functionality verification and performance evaluation. Implemented with as few as 140 Logic Elements, the proposed smart sensor was measured to have an error of -0.7degC~0.9degC over a wide temperature range of -40degC~130degC. The effective resolution is better than 0.1degC, and the power consumption is 8.42 muW at a sample rate of 2 samples/s. The performance is as good as those of most full-custom predecessors. The longest conversion time is around 260 mus, and a conversion rate of 3 kHz at least is promised.
Keywords :
VLSI; analogue-digital conversion; computerised instrumentation; field programmable gate arrays; intelligent sensors; logic devices; system-on-chip; temperature sensors; time-domain analysis; FPGA chips; SOC on-chip integrations; VLSI; analog-to-digital converter; cyclic delay line; digital output coding; fully digital low cost time domain smart temperature sensor; performance evaluation; power 8.42 muW; soft IP implementation; temperature -0.7 C to 0.9 C; temperature -40 C to 130 C; thermally sensitive pulse; Costs; Delay lines; Pulse generation; Pulse measurements; Semiconductor device measurement; Signal processing; Temperature measurement; Temperature sensors; Very large scale integration; Voltage; cyclic delay line; fully digital smart sensor; low cost; on-chip integration; smart sensor; temperature sensor; time domain;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference, 2006. ASSCC 2006. IEEE Asian
Conference_Location :
Hangzhou
Print_ISBN :
0-7803-9734-7
Electronic_ISBN :
0-7803-97375-5
Type :
conf
DOI :
10.1109/ASSCC.2006.357873
Filename :
4197612
Link To Document :
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