DocumentCode
2560496
Title
Functional failure analysis on analog device by optical beam induced current technique
Author
Tan, K.T. ; Tan, S.H. ; Ong, S.H.
Author_Institution
Nat. Semicond., Singapore
fYear
1997
fDate
21-25 Jul 1997
Firstpage
296
Lastpage
301
Abstract
Photoinduced current can be measured and used to modulate the gray-level of the OBIC images. Thus, the OBIC image can be used to localize the damaged transistor in LSI and VLSI devices. This is because when the pn junctions are destroyed, the leakage path no longer exhibits any blocking behavior, and thus no OBIC effect will be present. This paper presents two cases of failure analysis performed on analog devices using OBIC technique. The analysis steps and methodology used to determine the failure mechanism are described
Keywords
OBIC; VLSI; analogue integrated circuits; failure analysis; integrated circuit reliability; integrated circuit testing; large scale integration; leakage currents; LSI; VLSI; analog IC devices; damaged transistor; failure mechanism; functional failure analysis; gray-level; leakage path; optical beam induced current technique; photoinduced current; Charge carriers; Circuits; Current measurement; Demodulation; Failure analysis; Laser beams; Optical beams; Optical films; Signal to noise ratio; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical & Failure Analysis of Integrated Circuits, 1997., Proceedings of the 1997 6th International Symposium on
Print_ISBN
0-7803-3985-1
Type
conf
DOI
10.1109/IPFA.1997.638367
Filename
638367
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