• DocumentCode
    2560792
  • Title

    Numerical and experimental evaluation of planar and staggered heat sinks

  • Author

    Sathyamurthy, P. ; Runstadler, P.W. ; Lee, S.

  • Author_Institution
    Fluent Inc., Lebanon, NH, USA
  • fYear
    1996
  • fDate
    29 May-1 Jun 1996
  • Firstpage
    132
  • Lastpage
    139
  • Abstract
    The performance of an air-cooled planar and staggered bonded heat sink is evaluated using both experimental and numerical approaches. The performance is evaluated for three power settings of 100, 150, and 200 W and for three approach velocities at 200, 400, and 600 ft/min. The comparison of the measurements and predictions shows good agreement, indicating that computational methods of the type employed in this work are a cost effective means of designing and evaluating high-performance heat sinks. The results demonstrate that the thermal performance of the staggered fin configuration is superior over the planar fin configuration by approximately 8% over the power and flow ranges examined herein. This enhanced thermal performance, however, was realized at the expense of an additional pressure drop of 10 to 20%
  • Keywords
    cooling; forced convection; heat sinks; integrated circuit packaging; numerical analysis; temperature distribution; thermal analysis; air-cooled bonded heat sink; approach velocities; computational methods; flow range; high-performance heat sinks; planar fin configuration; planar heat sinks; power range; pressure drop; staggered fin configuration; staggered heat sinks; thermal performance; Bonding; Coolants; Costs; Heat sinks; Heat transfer; Maintenance; Manufacturing; Microelectronics; Temperature; Thermal management of electronics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Phenomena in Electronic Systems, 1996. I-THERM V., Inter-Society Conference on
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    0-7803-3325-X
  • Type

    conf

  • DOI
    10.1109/ITHERM.1996.534554
  • Filename
    534554